Equipment

YAG Laser Scribing System

YAG Laser Scribing System

The YAG Laser Scribing Machine utilises a YAG laser, producing a continuous cut or scribe, which is used to remove the conductive oxide layer from glass substrates so that a series connect tile can be produced. The software allows the machine to be programmed for your specific substrates and designs.

Description

The wavelength utilised renders the system suitable for plastics and glass. YAG laser ablates the TCO without damaging the underlying glass; this leads isolations without residual material piled up at the edges. This is important for perovskites due to the small thickness of the active layers (compared to DSC), as the piled up material can form shorting pathways. Machine includes: precision scribing, use of custom CAD files, and high speed operation.
· Use the YAG Laser Scribing Machine to remove the conductive oxide layer from glass substrates to produce a series connect substrate and to laser scribe and identify test cells and other products.

Specifications

Laser output power
75W
Laser wavelength
1064nm
Selective Marking scope
70mm*70mm 150mm*150mm 200mm*200mm
Beam quality
M2 <3
Marking depth
0.01~0.2mm
Marking speed
7000mm/s
Repeated accuracy
±0.01mm
Minimum character
0.1mm
Minimum line width
0.015mm
Gross weight
120kg
Electric power requirement
220V/50-60Hz
Machine power
3 kW
Mainframe Dimensions
240mm*1280mm*1200mm
Control Cabinet Dimensions
590mm*560mm*800mm
Water Cooling Machine Dimensions
540mm*700mm*900mm
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